Latest resources from TDK Invensense
Wafer Level Packaging of MOEMS Solves Manufac...
This paper will examine the key packaging challenges in the fabrication of a 1000x1000 OXC, using MOEMS (micro-optical-electromechanical-systems) m...
Image Stabilization Technology Overview
Optical image stabilization (OIS) addresses the quality of images, and is an idea that has been around for at least 30 years. It has only recently ...
Wafer-Scale Packaging and Integration Are Cre...
This paper will describe a new approach coming to the market that will break the barrier to creating the ideal in motion sensors with the promise t...