Latest Whitepapers
Advantages of Stamped and Formed Technologies in Power Connectors
Tyco Electronics has developed and produced power connectors using alternative manufacturing technologies...
Top 10 Concerns For Signal Connections
As more and more devices are added to the plant floor, secure and reliable signal connections are of...
FIPS 140-2 and Wi-Fi Client Devices
With throughput much greater than that available with previous wireless local area networking (WLAN)...
Flash Corruption: Software Bug or Supply Voltage Fault?
Flash memory is commonly used to store firmware in embedded systems. Occasionally, the firmware stored...
X-500 / X-55 Series SLC vs. EM-MLC
Swissbit's latest SSD generation is available in 2 versions. Firstly, the X-500: based on SLC NAND flash...
An Overview of Motion Processing Solutions for Consumer Products
This paper discusses the usage of common sensor types and how sensors can be effectively combined in...
eGaN® FET Drivers and Layout Considerations
When considering gate drive requirements, the three most important parameters for eGaN FETs are (1) the...
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
Practical Guide to Maximizing DC Measurement Performance
This guide will begin by reviewing instrument fundamentals, learning how to use SMUs, and examining the...
Scalability in SNAP Mesh Networks
It is projected that 100 billion new “uniquely identifiable objects” will be connected to the Internet...
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