Analog
Universal, Scalable Factorized Power Architecture for New Processors and Memory Loads
HPC (High Performance Computing) processors and memory loads continue to increase power demands at lower...
5G NR‑V2X For Enhanced Automotive Communications
This white paper provides a technology deep dive into the architecture, protocols and physical layer...
Dual Protocol Transceivers Ease the Design of Industrial Interfaces
This white paper discusses the industry's most commonly used interface standards, RS-232 and RS-485,...
Memory Coalition of Excellence:Recommendations for the National Semiconductor Technology Center
Microelectronic chips, also known as integrated circuits (ICs), are at the heart of our modernday society.Discrete...
RS-485 Isolator Raises the Bar for Bus Node Designs
This white paper focuses on isolated digital interfaces conforming to RS-485, which continues to be the...
VIA PFM from Vicor Enables Power Component Design Methodology from AC to the Point of Load
This White Paper describes how the new VIA PFM, a power component that performs the front-end AC-DC conversion...
HDMI® Enhanced Audio Return Channel (eARC) Future Proofs Home Theater Connectivity with Uncompromised Audio Quality
HDMI Version 2.1 is the specification's most substantial upgrade. Video delivery speed increases 300%,...
Cooling Fans Contributing to Effective Use of Power
Sanyo Denki has a lineup of 12 counter rotating fans to cover high air flow and high static pressure...
Thermal Management for Surface-Mount Devices
The origins of the ambient derating curve go back decades to when the U.S. military specified the performance...
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