Communication
DRAM MEMORY MODULE RANK CALCULATION
Each memory module has rank based on how DRAM chips are organized. A memory rank is a set of DRAM chips...
eGaN® FETs in High Frequency Resonant Converters
In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously,...
5G Evolution – On The Path To 6G
Pushing the limits of 5G 5G New Radio (5G NR) network rollouts are in full swing globally, with standardization...
Just Talk! Voice Controllers for the Internet of Things
In less than a decade, tens of billions of electronic devices will be connected to the Internet-of-Things...
Debugging Conducted Emissions with Oscilloscopes made easy
Getting EMI emissions under control is one of those tasks that RandD engineers do not enjoy doing . EMI...
EMC Test Solutions on The Cutting Edge
Upcoming technologies such as 5G for wireless communications and the increasing amount of integrated...
Accumold overview
These micro molding guidelines reflect some of the capabilities we have been asked for and are intended...
Basics of Dual Fractional-N Synthesizers/PLLs
Over the years, a number of methods have been proposed to realize fractional-N frequency synthesis that...
Challenges and Solutions for Fiber-to-the-Antenna Networks
In the evolution to advanced 3G and 4G services, wireless service providers are taking fiber to the top...
Using Non-transparent Bridging in PCI Express Systems
PCI was originally designed as an interconnect for personal computers,because of the nature of PCs at...
Battery Simulation with DC power supply R&S®NGM200
This application note is about creating your own battery model for the RandS®NGM200, beyond the standard...
Wireless Transceivers—Make or Buy?
The question of whether to make or buy a component has been around as long as engineering departments....
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