Components
Updated Facts On 2015 HCFC-225 Usage Ban
Beginning January 1, 2015, HCFC-225 (also called “AK225”), a common precision solvent for high-end...
Addressing Thermal Challenges in High‐Density Power Applications
Demand for more features and higher performance from ever-smaller form factors presents significant challenges...
Factorized Power Architecture and VI BRICKs
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
Validation and Deployment Concerns to Maintain Acceptable Risk
In order to ensure an acceptable level of residual risk has been achieved prior to deploying equipment...
FIPS 140-2 and Wi-Fi Client Devices
With throughput much greater than that available with previous wireless local area networking (WLAN)...
Maximize Your Uptime: Reducing Risk of Power Supply Failure
Low-power electrical transients generated within a facility are the primary cause of failure to AC/DC...
Medical Ultrasound
A medical ultrasound uses highfrequency sound waves to produce diagnostic images of organs, joints, blood...
Driving AC-DC power supply efficiency even higher
Reducing the size and improving the efficiency of AC-DC power supplies are constant pressures. In addition...
KOAXXA SMA RF Interconnects Innovation & Technology
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect...
Designing for Quiet, Vibration-Free Operation
Solutions to problems such as excessive noise levels or objectionable sound signatures to inaccuracies...
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