Processors
Material Advances Enable New Generation of Power Inductors
Designers building power inductors for today's highly volume mobile markets face a difficult dilemma....
JESD204A for wireless base station and radar systems
Digital Signal Processing (DSP) technology continues to transform radar systems and wireless cellular...
Factorized Power Architecture and VI BRICKs
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
FPGAs in Next Generation Wireless Networks
In addition to voice connectivity, digital cellular wireless networks such as GSM and its enhancement,...
Leakage Currents in the Right Perspective
Trade-off between best attenuation effectiveness and minimum leakage current. Network filters (EMC filters)...
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
2:1 MIPI CSI-2 Bridge Soft IP
In some cases, mobile Application Processors (AP) may not have enough interfaces to support the number...
CMOS to MIPI D-PHY Interface Bridge Soft IP
MIPI D-PHY is a practical PHY for typical camera and display applications. It is designed to replace...
Ball vs. Sleeve: A Comparison In Bearing Performance
As consumers demand smaller, faster computer systems, OEM design engineers race to create systems with...
Flash Corruption: Software Bug or Supply Voltage Fault?
Flash memory is commonly used to store firmware in embedded systems. Occasionally, the firmware stored...
Sign up for Electronic Pro Tech Publish Hub
As a subscriber you will receive alerts and free access to our constantly updated library of white papers, analyst reports, case studies, web seminars and solution reports.
