Latest resources from TE Connectivity
KOAXXA SMA RF Interconnects Innovation & Tech...
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect product portfolio. Our KOAXXA SMA product e...
Application of Full-wave 3D Field Solvers to ...
This paper presents an investigation into the usage of modeling techniques to predict and improve the shielding effectiveness of rectangular, metal...
Validation of Quasi-Analytical and Statistica...
Because today's high-speed, high-density backplane and I/O interconnects are pushing speeds well beyond 10 Gbps, accurate simulation of such system...