Latest resources from TE Connectivity
Presented at DesignCon 2009
When designing links, SI engineers often begin with a specific connector platform and then modify system variables such as trace length, dielectric...
Validation of Quasi-Analytical and Statistica...
Because today's high-speed, high-density backplane and I/O interconnects are pushing speeds well beyond 10 Gbps, accurate simulation of such system...
KOAXXA SMA RF Interconnects Innovation & Tech...
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect product portfolio. Our KOAXXA SMA product e...