Latest Whitepapers
KOAXXA SMA RF Interconnects Innovation & Technology
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect...
IEEE 802.11be Technology Introduction
The IEEE 802.11 working group develops the wireless local area network (WLAN) specifications behind the...
MODELING OF SYNTHETIC JET EJECTORS FOR ELECTRONICS COOLING
This paper presents the modeling results for prediction of thermal performance using synthetic jets ejectors....
Hi-pot Type Testing Application Note
This Application Note was written to provide insight into the one time requirement for ‘type' testing...
DEVELOPMENT OF HIGH-PERFORMANCE, HIGH-VOLUME CONSUMER MEMS GYROSCOPES
This paper discusses the challenges and success factors for creating the world's first integrated MEMS...
How do you create a RoHS Compliancy-Lead-free Roadmap?
When a company begins the transition to lead-free it impacts the whole organization. The cost of transition...
Considerations for Building Out Your Connected Device Strategy
The Internet of Things (IoT) has nearly eclipsed the splendor of “big data”—in fact, it's enveloping...
Using Non-transparent Bridging in PCI Express Systems
PCI was originally designed as an interconnect for personal computers,because of the nature of PCs at...
Crydom RHP Series 3 Phase Hybrid Solid State Contactor
Solid State Relays and Contactors (SSRs) have been available in one form or the other for over 40 years....
Advantages and Challenges of Third-Overtone IC Crystals
ICs with on-board oscillators requiring low frequency fundamental crystals are commonplace but now IC...
Increasing Reliability with Sealed Switches
While switch manufacturers play a large role in a device's reliability, the environmental conditions...
Wide Temperature Range Fan “San Ace T” Series 9GT Type
In recent years, photovoltaic power generation, electric vehicles, etc. have spread rapidly from the...
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